Package structure of a microphone
A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. Af...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste. |
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