Method of packaging a semiconductor die and package thereof

Method of packaging a semiconductor die and package thereof

A method of packaging a semiconductor die includes the steps of providing a flange ( 110 ), coupling one or more active die ( 341 ) to the flange with a lead-free die attach material ( 350 ), staking a leadframe ( 120 ) to the flange after coupling the one or more active die to the flange, electrica...

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Bibliographische Detailangaben
Hauptverfasser: VISWANATHAN LAKSHMINARAYAN, ABDO DAVID F, ELLIOTT ALEXANDER J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of packaging a semiconductor die includes the steps of providing a flange ( 110 ), coupling one or more active die ( 341 ) to the flange with a lead-free die attach material ( 350 ), staking a leadframe ( 120 ) to the flange after coupling the one or more active die to the flange, electrically interconnecting the one or more active die and the leadframe with an interconnect structure ( 470 ), and applying a plastic material ( 130 ) over the flange, the one or more active die, the leadframe, and the interconnect structure.