System to wirebond power signals to flip-chip core

System to wirebond power signals to flip-chip core

A system may include an integrated circuit die defining a plurality of inner apertures, and a conductive element disposed on two or more of the plurality of inner apertures and electrically connected to an electrical conductor through the two or more inner apertures. In some embodiments, the integra...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MATHEW RANJAN J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A system may include an integrated circuit die defining a plurality of inner apertures, and a conductive element disposed on two or more of the plurality of inner apertures and electrically connected to an electrical conductor through the two or more inner apertures. In some embodiments, the integrated circuit die defines a plurality of peripheral apertures and also includes a conductive pillar disposed on one of the plurality of peripheral apertures and electrically connected to a second electrical conductor through the peripheral aperture.