Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

A multi-chip package sharing a temperature-compensated self-refresh (TCSR) signal and method thereof is disclosed. The multi-chip package may include a plurality of chips. At least one of the plurality of chips may generate a TCSR signal. A remainder of the plurality of chips may be configured to re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: LEE HEON-GWON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:A multi-chip package sharing a temperature-compensated self-refresh (TCSR) signal and method thereof is disclosed. The multi-chip package may include a plurality of chips. At least one of the plurality of chips may generate a TCSR signal. A remainder of the plurality of chips may be configured to receive the TCSR signal. A pad may be commonly connected to the plurality of chips.