PACKAGING WITH SUBSEQUENTLY MOLDED FORM-FIT CONNECTION

The present invention relates to a packaging with a packaging trough, into which a packaging material can be filled and which is closed with a lid, whereby at least one form-fit connection connects the packaging trough with the lid and the connection comprises a first and a second connection means....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEND DIETMAR, RIEGGER PETER, WOKURKA JOACHIM DR
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a packaging with a packaging trough, into which a packaging material can be filled and which is closed with a lid, whereby at least one form-fit connection connects the packaging trough with the lid and the connection comprises a first and a second connection means. Furthermore, the present invention relates to a method for the production of a packaging as well as a packaging machine.