Method of treating a substrate, method of processing a substrate using a laser beam, and arrangement
The present invention relates generally to a method of and arrangement treating a substrate processed using a laser beam, wherein said substrate comprises at least a body of semiconductor material. The method comprises a step of etching said substrate for removing from said body of semiconductor mat...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates generally to a method of and arrangement treating a substrate processed using a laser beam, wherein said substrate comprises at least a body of semiconductor material. The method comprises a step of etching said substrate for removing from said body of semiconductor material recast material deposited on said body during said laser processing. In particular, the step of etching is controlled for removing at least a part of said semiconductor material of said body for improving mechanical strength of said substrate. |
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