METHOD TO IMPROVE PROFILE CONTROL AND N/P LOADING IN DUAL DOPED GATE APPLICATIONS

A semiconductor processing system is provided. The semiconductor processing system includes a chamber. The chamber includes a gas inlet, a top electrode configured to strike a plasma inside the chamber, and a support for holding a substrate. A controller configured to detect a passivation starved co...

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Bibliographische Detailangaben
Hauptverfasser: LIN FRANK, DEL PUPPO HELENE, LEE CHRIS, VAHEDI VAHID, SINGH HARMEET, MILLER ALAN J, ULLAL SAURABH, KAMP THOMAS A
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor processing system is provided. The semiconductor processing system includes a chamber. The chamber includes a gas inlet, a top electrode configured to strike a plasma inside the chamber, and a support for holding a substrate. A controller configured to detect a passivation starved condition during an etching operation is provided. The controller is further configured to introduce a passivation enhancing gas through the gas inlet during the etching operation in response to detecting the passivation starved condition.