Alloys for flip chip interconnects and bumps
The present invention provides alloys for forming sputtered under bump metallization seed layers and electroplated or otherwise deposited bump metallurgy. The alloys of the present invention are comprised of silver with gold or palladium, copper with gold, or gold with nickel or palladium which prov...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention provides alloys for forming sputtered under bump metallization seed layers and electroplated or otherwise deposited bump metallurgy. The alloys of the present invention are comprised of silver with gold or palladium, copper with gold, or gold with nickel or palladium which provide suitable sputtering and electrical characteristics and resistance to corrosion and tarnishing. The invention further provides for semiconductor devices made from metal alloys for UBM and bump metallurgy, and for a method of making such semiconductor devices. |
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