Thermoplastic molding compositions

Thermoplastic molding compositions, comprising A) a polyamide A1), containing at least one end group derived from a piperidine compound, and B) a copolymer which contains at least one functional group which can react with the end groups of the polyamide present in component A).

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Bibliographische Detailangaben
Hauptverfasser: HAENSEL WERNER, DEININGER JURGEN, GOTTSCHELK AXEL, HONL HANS, WEBER MARTIN, HECKMANN WALTER
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Thermoplastic molding compositions, comprising A) a polyamide A1), containing at least one end group derived from a piperidine compound, and B) a copolymer which contains at least one functional group which can react with the end groups of the polyamide present in component A).