Contact spacer formation using atomic layer deposition

A contact structure in a semiconductor device includes a layer of dielectric material and a via formed through the dielectric material. The contact structure further includes a spacer formed on sidewalls of the via using atomic layer deposition (ALD) and a metal deposited in the via.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JOSHI AMOL R, CHENG NING, AGARWAL ANKUR B, TAKAGI NORIMITSU, NGO MINH V, HUI ANGELA T, LI WENMEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A contact structure in a semiconductor device includes a layer of dielectric material and a via formed through the dielectric material. The contact structure further includes a spacer formed on sidewalls of the via using atomic layer deposition (ALD) and a metal deposited in the via.