Polyoxymethylene molding compounds

Polyoxymethylene molding compounds

Thermoplastic molding compositions, comprising A) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymer B) from 0.05 to 10% by weight of a nonpolar polypropylene wax, C) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids hav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAUERER WOLFGANG, HEINEMANN JOHANNES
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:Thermoplastic molding compositions, comprising A) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymer B) from 0.05 to 10% by weight of a nonpolar polypropylene wax, C) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids having from 10 to 40 carbon atoms with saturated aliphatic alcohols or amines having from 2 to 40 carbon atoms, D) from 0 to 80% by weight of other additives, where the total of the percentages by weight of components A) to D) is always 100%.