GROUPING SYSTEMATIC DEFECTS WITH FEEDBACK FROM ELECTRICAL INSPECTION

GROUPING SYSTEMATIC DEFECTS WITH FEEDBACK FROM ELECTRICAL INSPECTION

Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborh...

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Bibliographische Detailangaben
Hauptverfasser: RAVID EREZ, BOKOBZA OFER, SVIDENKO VICKY, SHIMSHI RINAT, ORBON JACOB J, BEN-PORATH ARIEL, NEHMADI YOUVAL
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Zusammenfassung:Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.