Process for Preparing Multilayer Structure Product

A process for preparing a multilayer structure product in which it quickly becomes possible to obtain a satisfactory molded article after restarting the molding without using a special purging agent. In the process, which comprises feeding a saponified ethylene/vinyl acetate copolymer and other resi...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAZUMI SHINTA, EMOTO YOSHIO, INOUE KAORU
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A process for preparing a multilayer structure product in which it quickly becomes possible to obtain a satisfactory molded article after restarting the molding without using a special purging agent. In the process, which comprises feeding a saponified ethylene/vinyl acetate copolymer and other resins to a melt-molding machine having a die to mold a multilayer structure product, the saponified ethylene/vinyl acetate copolymer residing in the melt-molding machine is allowed to stand at a temperature lower by 0 to 100° C. than the melt-molding temperature throughout the period from a melt-molding process conducted for a certain time to restarting a melt-molding process.