Hermetic cavity package

Hermetic cavity package

A packaging structure ( 10 ) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure ( 10 ) comprises first and second packaging layers ( 12, 28 ) forming a cavity. Two liquid crystal polymer (LCP) layers ( 16, 22 ) are formed between and hermetically se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FRANSON STEVEN J, EMRICK RUDY M, BOSCO BRUCE A, ROCKWELL STEPHEN K, HOLMES JOHN E
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A packaging structure ( 10 ) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure ( 10 ) comprises first and second packaging layers ( 12, 28 ) forming a cavity. Two liquid crystal polymer (LCP) layers ( 16, 22 ) are formed between and hermetically seal the first and second packaging layers ( 12, 28 ). First and second conductive strips ( 18, 20 ) are formed between the LCP layers ( 16, 22 ) and extend into the cavity. An electronic device ( 24 ) is positioned within the cavity and is coupled to the first and second conductive strips ( 18, 20 ).