Cooling system for a substrate

The present invention relates to a cooling system, the cooling system having a nozzle which receives coolant from a reservoir and which faces a substrate. The nozzle may be opened and closed by a thermally responsive valve allowing the coolant to be automatically metered to the substrate, thus contr...

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Bibliographische Detailangaben
Hauptverfasser:	REBELLO KEITH J, BEVAN MATTHEW G, SZCZEPANOWSKI RAFAL P, ADAMS ALAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a cooling system, the cooling system having a nozzle which receives coolant from a reservoir and which faces a substrate. The nozzle may be opened and closed by a thermally responsive valve allowing the coolant to be automatically metered to the substrate, thus controlling the spatial distribution of the coolant that is applied to the substrate. This approach allows hotter areas of the substrate to receive more coolant, thus eliminating nonuniformities in the thermal profile of the substrate.