Process for producing an integrated circuit comprising a capacitor

An integrated circuit is produced to include interconnection levels each incorporating a metallization level covered with an insulating material. The integrated circuit includes at least one capacitor possessing at least one part lying within a single interconnection level. The capacitor is produced...

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Bibliographische Detailangaben
Hauptverfasser: GIRAUDIN JEANRISTOPHE, ROSSATO CHRISTINE, JAGUENEAU THIERRY
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An integrated circuit is produced to include interconnection levels each incorporating a metallization level covered with an insulating material. The integrated circuit includes at least one capacitor possessing at least one part lying within a single interconnection level. The capacitor is produced before the interconnection level is produced. The covering of part of the capacitor with an insulating protective layer occurs before the metallization level of the interconnection level is produced.