Supply plate for an electrochemical system

The present invention relates to supply plate ( 1 ), a base plate for the assembly of such a supply plate, as well as a method for manufacturing a supply plate for electrochemical systems. Two base plates ( 2 a, 2 b) are thermally joined to one another using a joining agent, wherein this joining age...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TASCH DOMINIQUE, STROEBEL RAIMUND, GAUGLER BERND, HOHE KURT
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to supply plate ( 1 ), a base plate for the assembly of such a supply plate, as well as a method for manufacturing a supply plate for electrochemical systems. Two base plates ( 2 a, 2 b) are thermally joined to one another using a joining agent, wherein this joining agent ( 3 ) has a lower melting point than the material of the base plates ( 2 a, 2 b). At least one first base plate ( 2 a) comprises at least one pocket ( 4 a) into which joining agent is filled, and subsequently the second base plate ( 2 b) is applied onto a joining plane (F) of the first plate, and a connection of the base plates ( 2 a, 2 b) is effected by way of the impact of heat on the joining agent.