Method for improving the thermal cycled adhesion of thick-film conductors on dielectric

An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that h...

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Bibliographische Detailangaben
Hauptverfasser: CARTER BRADLEY H, FLEDERBACH LYNDA G, ISENBERG JOHN K
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.