Composition Based On isotactic Polypropylene Obtained By Metallocene Catalysis And On Grafted isotactic Polypropylene Obtained by Ziegler-Natta Catalysis

A heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence the heat-dissipating device can dissipate efficiently the heat from the C...

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Bibliographische Detailangaben
Hauptverfasser:	CHOU CHIA-MIN, TSENG HSIANGIEH
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence the heat-dissipating device can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.