Defect inspection method
By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The thres...
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creator | KANEGAE KENSHI |
description | By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The threshold is set based on the maximum intensity of a noise signal included in the digital image signal. |
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When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The threshold is set based on the maximum intensity of a noise signal included in the digital image signal.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CALCULATING ; CINEMATOGRAPHY ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HANDLING RECORD CARRIERS ; HOLOGRAPHY ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061005&DB=EPODOC&CC=US&NR=2006222235A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061005&DB=EPODOC&CC=US&NR=2006222235A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANEGAE KENSHI</creatorcontrib><title>Defect inspection method</title><description>By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. 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When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The threshold is set based on the maximum intensity of a noise signal included in the digital image signal.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HANDLING RECORD CARRIERS HOLOGRAPHY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TESTING |
title | Defect inspection method |
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