Defect inspection method

By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The thres...

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Bibliographische Detailangaben
1. Verfasser:	KANEGAE KENSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HANDLING RECORD CARRIERS HOLOGRAPHY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The threshold is set based on the maximum intensity of a noise signal included in the digital image signal.