Measuring low dielectric constant film properties during processing

Measuring low dielectric constant film properties during processing

A method and system for determining the dielectric constant of a low-k dielectric film on a production substrate include measuring the electronic component of the dielectric constant using an ellipsometer, measuring the ionic component of the dielectric constant using an IR spectrometer, measuring t...

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Bibliographische Detailangaben
Hauptverfasser: SU YI-NIEN, TAO HUN-JAN, HSU PENG-FU, TSAI JANG-SHIANG, HSU JU-WANG, PERNG BAWING, SHIEH JYU-HORNG
Format: Patent
Sprache:eng
Schlagworte:
COLORIMETRY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
RADIATION PYROMETRY
TESTING
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Beschreibung
Zusammenfassung:A method and system for determining the dielectric constant of a low-k dielectric film on a production substrate include measuring the electronic component of the dielectric constant using an ellipsometer, measuring the ionic component of the dielectric constant using an IR spectrometer, measuring the overall dielectric constant using a microwave spectrometer and deriving the dipolar component of the dielectric constant. The measurements and determination are non-contact and may be carried out on a production device that is further processed following the measurements.