LED device with flip chip structure

LED device with flip chip structure

The present invention provides an LED device with a flip chip structure. The LED device comprises an insulating substrate, an LED flip chip, a molding compound, a first conductive element, and a second conductive element. The LED flip chip is electrically connected to the connection pads on the insu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG CHUAN-MING, WANG CHIEN-JEN, CHANG NAI-WEN, CHIANG KUOUN, WANG WEI-JEN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention provides an LED device with a flip chip structure. The LED device comprises an insulating substrate, an LED flip chip, a molding compound, a first conductive element, and a second conductive element. The LED flip chip is electrically connected to the connection pads on the insulating substrate via the two conductive elements. The P-type and N-type electrodes are connected to the P-type and N-type electrodes layers, respectively. The invention need not require a conventional wire bonding process. It not only increases the yield rate of the product but also makes the product more compact.