Optical semiconductor device, electronic device, and method for producing optical semiconductor device
A resin molded portion 5 is provided with a first protruding molded portion 17 that protrudes from a first inclination portion 11 and a second protruding molded portion 18 that protrudes from a second inclination portion 12. The first protruding molded portion 17 and the second protruding molded por...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A resin molded portion 5 is provided with a first protruding molded portion 17 that protrudes from a first inclination portion 11 and a second protruding molded portion 18 that protrudes from a second inclination portion 12. The first protruding molded portion 17 and the second protruding molded portion 18 are diced along dicing lines DL in the same manner as a wiring substrate 1 so that a first protruding portion 17 b and a second protruding portion 18 b are formed on the first inclination portion 11 and the second inclination portion 12, respectively. The first protruding portion 17 b and the second protruding portion 18 b have flat portions 17 s and 18 s in the direction perpendicular to the plane surface of the wiring substrate 1. |
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