METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KNOX MARC D, GARDELL DAVID L, GASCHKE PAUL M, AUBE PAUL J, TURCOTTE DENIS D, GAMACHE ROGER G.JR, COTE NORMAND
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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