METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after...

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Bibliographische Detailangaben
Hauptverfasser: KNOX MARC D, GARDELL DAVID L, GASCHKE PAUL M, AUBE PAUL J, TURCOTTE DENIS D, GAMACHE ROGER G.JR, COTE NORMAND
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.