METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KNOX MARC D, GARDELL DAVID L, GASCHKE PAUL M, AUBE PAUL J, TURCOTTE DENIS D, GAMACHE ROGER G.JR, COTE NORMAND
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KNOX MARC D
GARDELL DAVID L
GASCHKE PAUL M
AUBE PAUL J
TURCOTTE DENIS D
GAMACHE ROGER G.JR
COTE NORMAND
description A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2006186909A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2006186909A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2006186909A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEuDqK-w4Gz0CqIHY_0aoJtLiQXwakUSSfRQn1_rOADOPz8y7fMhpZEcwVo55xDjxID1OxBqHXs0d9ANPkWG1AcXWPsGbiePVBDSjxbo6Ciq1EEwoCgCQWCsReoov9qoSDrbDH0jyltfl9l25pE6V0aX12axv6enundxbDP82NxOpZ5icXhP_UBYFI1sA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST</title><source>esp@cenet</source><creator>KNOX MARC D ; GARDELL DAVID L ; GASCHKE PAUL M ; AUBE PAUL J ; TURCOTTE DENIS D ; GAMACHE ROGER G.JR ; COTE NORMAND</creator><creatorcontrib>KNOX MARC D ; GARDELL DAVID L ; GASCHKE PAUL M ; AUBE PAUL J ; TURCOTTE DENIS D ; GAMACHE ROGER G.JR ; COTE NORMAND</creatorcontrib><description>A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060824&amp;DB=EPODOC&amp;CC=US&amp;NR=2006186909A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060824&amp;DB=EPODOC&amp;CC=US&amp;NR=2006186909A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KNOX MARC D</creatorcontrib><creatorcontrib>GARDELL DAVID L</creatorcontrib><creatorcontrib>GASCHKE PAUL M</creatorcontrib><creatorcontrib>AUBE PAUL J</creatorcontrib><creatorcontrib>TURCOTTE DENIS D</creatorcontrib><creatorcontrib>GAMACHE ROGER G.JR</creatorcontrib><creatorcontrib>COTE NORMAND</creatorcontrib><title>METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST</title><description>A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w4Gz0CqIHY_0aoJtLiQXwakUSSfRQn1_rOADOPz8y7fMhpZEcwVo55xDjxID1OxBqHXs0d9ANPkWG1AcXWPsGbiePVBDSjxbo6Ciq1EEwoCgCQWCsReoov9qoSDrbDH0jyltfl9l25pE6V0aX12axv6enundxbDP82NxOpZ5icXhP_UBYFI1sA</recordid><startdate>20060824</startdate><enddate>20060824</enddate><creator>KNOX MARC D</creator><creator>GARDELL DAVID L</creator><creator>GASCHKE PAUL M</creator><creator>AUBE PAUL J</creator><creator>TURCOTTE DENIS D</creator><creator>GAMACHE ROGER G.JR</creator><creator>COTE NORMAND</creator><scope>EVB</scope></search><sort><creationdate>20060824</creationdate><title>METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST</title><author>KNOX MARC D ; GARDELL DAVID L ; GASCHKE PAUL M ; AUBE PAUL J ; TURCOTTE DENIS D ; GAMACHE ROGER G.JR ; COTE NORMAND</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2006186909A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KNOX MARC D</creatorcontrib><creatorcontrib>GARDELL DAVID L</creatorcontrib><creatorcontrib>GASCHKE PAUL M</creatorcontrib><creatorcontrib>AUBE PAUL J</creatorcontrib><creatorcontrib>TURCOTTE DENIS D</creatorcontrib><creatorcontrib>GAMACHE ROGER G.JR</creatorcontrib><creatorcontrib>COTE NORMAND</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KNOX MARC D</au><au>GARDELL DAVID L</au><au>GASCHKE PAUL M</au><au>AUBE PAUL J</au><au>TURCOTTE DENIS D</au><au>GAMACHE ROGER G.JR</au><au>COTE NORMAND</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST</title><date>2006-08-24</date><risdate>2006</risdate><abstract>A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2006186909A1
source esp@cenet
subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T07%3A40%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KNOX%20MARC%20D&rft.date=2006-08-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2006186909A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true