Assembly comprising multiple microelectronic modules

An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a ho...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GLOVATSKY ANDREW Z, STOICA VLADIMIR
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.