Integrated circuit arrangement with low-resistance contacts and method for production thereof

An integrated circuit arrangement and fabrication method is presented. The integrated circuit arrangement contains a semiconductor and a metal electrode. The contact area between a semiconductor and the electrode is increased without increasing the lateral dimensions using partial regions of the sem...

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Hauptverfasser:	ROESNER WOLFGANG, HOFMANN FRANZ, SPECHT MICHAEL, LUYKEN RICHARD J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	ROESNER WOLFGANG HOFMANN FRANZ SPECHT MICHAEL LUYKEN RICHARD J
description	An integrated circuit arrangement and fabrication method is presented. The integrated circuit arrangement contains a semiconductor and a metal electrode. The contact area between a semiconductor and the electrode is increased without increasing the lateral dimensions using partial regions of the semiconductor and/or of the electrode that extend through a transition layer between the semiconductor and electrode.
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title	Integrated circuit arrangement with low-resistance contacts and method for production thereof
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