Projection exposure system

A projection exposure system, intended in particular for microlithography, is used for generating, in an image plane, an image of a mask arranged in an object plane. The projection exposure system has a light source emitting projection light and projection optics arranged between the mask and the image. Starting from the mask, the following are arranged in the beam path of the projection optics: a first group of optical components with an overall positive refractive power; a second group of optical components with an overall negative refractive power; a third group of optical components with an overall positive refractive power; a fourth group of optical components with an overall negative refractive power, and, a fifth group of optical components with an overall positive refractive power. At least three optical subgroups having at least one optical component can be displaced along the optical axis of the projection optics. The first optical subgroup comprises the mask or at least one optical component from the first group of optical components. The second optical subgroup comprises at least one optical component from the second or the third group of optical components. The third optical subgroup comprises at least one optical component from the third or the fourth group of optical components. With such subgroups, efficient imaging error correction of the projection optics is possible.