Curable composition, underfill, and method

A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface terminati...

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Hauptverfasser: SCHATTENMANN FLORIAN J, MILLS RYAN C, CAMPBELL JOHN R, PRABHAKUMAR ANANTH, RUBINSZTAJN SLAWOMIR, TANOPI SANDEEP S, GIBSON DAVID A.III
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.