PACKAGE FOR A HIGH-FREQUENCY ELECTRONIC DEVICE
The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends over the cavity and the substrate. On the second side ( 3 ) of the substrate to which the cavity extends...
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| creator | HURKX GODEFRIDUS A.M KEMMEREN ANTONIUS LUCIEN A.M JANSMAN ANDREAS B.M DEKKER RONALD VAN NOORT WIBO D |
| description | The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends over the cavity and the substrate. On the second side ( 3 ) of the substrate to which the cavity extends, a heat sink ( 23 ) is available. The device is particularly suitable for use at high frequencies, for instance higher than 2 GHz and under conditions of high dissipation. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PACKAGE FOR A HIGH-FREQUENCY ELECTRONIC DEVICE |
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