PACKAGE FOR A HIGH-FREQUENCY ELECTRONIC DEVICE

PACKAGE FOR A HIGH-FREQUENCY ELECTRONIC DEVICE

The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends over the cavity and the substrate. On the second side ( 3 ) of the substrate to which the cavity extends...

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Bibliographische Detailangaben
Hauptverfasser: HURKX GODEFRIDUS A.M, KEMMEREN ANTONIUS LUCIEN A.M, JANSMAN ANDREAS B.M, DEKKER RONALD, VAN NOORT WIBO D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends over the cavity and the substrate. On the second side ( 3 ) of the substrate to which the cavity extends, a heat sink ( 23 ) is available. The device is particularly suitable for use at high frequencies, for instance higher than 2 GHz and under conditions of high dissipation.