Arrangement of input/output pads on an integrated circuit

Input/output pads are arranged on an integrated circuit. Input/output pads are placed around a perimeter of core circuitry. Each input/output pad has an input/output pad bond opening with a height in a direction perpendicular to the perimeter of the core circuitry and with a width in a direction par...

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Bibliographische Detailangaben
1. Verfasser:	BRUCH THOMAS P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Input/output pads are arranged on an integrated circuit. Input/output pads are placed around a perimeter of core circuitry. Each input/output pad has an input/output pad bond opening with a height in a direction perpendicular to the perimeter of the core circuitry and with a width in a direction parallel to the perimeter of the core circuit. A first group of the input/output pad bond openings is placed at a first distance from the core circuitry. Height for the input/output pad bond openings within the first group is greater than width for the input/output pad bond openings within the first group. A second group of the input/output pad bond openings is placed at a second distance from the core circuitry. Height for the input/output pad bond openings within the second group is less than width for the input/output pad bond openings within the second group.