Press pack power semiconductor module
The high-power pack semiconductor module ( 1 ) comprises a layer ( 3, 4 ), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, ( 2 ), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailor...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The high-power pack semiconductor module ( 1 ) comprises a layer ( 3, 4 ), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, ( 2 ), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailored to a value either close or matching that of Si. |
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