Controlled cooling methods and apparatus for laser sintering part-cake

The invention is a method for controllably cooling at least a portion of a part-cake from a laser sintering system to minimize cool down time, maximize throughput, and minimize thermal gradients within the part-cake. The method generally comprises forming one or more thermal transfer channels within the part-cake. The thermal transfer channels can include ducts and cooling fins in the part-cake surrounding the formed part. The method can further comprise removing unfused powder from the ducts and introducing cooling media into the ducts. The invention also includes a part-cake having thermal transfer channels formed therein and a laser sintering apparatus comprising a part-cake containing cylinder having permanent fittings therein for receiving terminal portions of thermal transfer channels formed in the part-cake.