Semiconductor component package
A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat dissipating element is preferably made by stamping, and is formed from an essentially uniform thickness heat...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat dissipating element is preferably made by stamping, and is formed from an essentially uniform thickness heat conducting sheet. The element is formed so as to have two portions of different heights, the portion with the smaller height overlying but not touching the semiconductor component or wires connecting the semiconductor component. |
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