Method and apparatus for probe tip contact
The invention is a method and apparatus for a probe tip contact for electrically coupling a substrate to a probe tip. The apparatus, in one embodiment, comprises a wrap-around contact that is precision formed utilizing a hydroform tool and brazed to a surface of a substrate. In another embodiment, t...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention is a method and apparatus for a probe tip contact for electrically coupling a substrate to a probe tip. The apparatus, in one embodiment, comprises a wrap-around contact that is precision formed utilizing a hydroform tool and brazed to a surface of a substrate. In another embodiment, the apparatus comprises a contact flange, a mounting flange extending from a first edge of the contact flange in an orientation substantially perpendicular to the contact flange, and a substantially circular indentation formed in the contact flange adapted for accommodating movement of said probe tip relative to said substrate. |
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