Methods for reducing protrusions and within die thickness variations on plated thin film

Embodiments of the invention provide methods for electroplating a substrate that substantially reduce or eliminate protrusions and decrease WID thickness variations. The number of protrusions formed on the plating surface is highly dependent upon the electroplating current density. Embodiments of th...

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Bibliographische Detailangaben
Hauptverfasser:	CAO YANG, CHIKARMANE VINAY B, RASTOGI RAJIV, ZIERATH DANIEL J
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of the invention provide methods for electroplating a substrate that substantially reduce or eliminate protrusions and decrease WID thickness variations. The number of protrusions formed on the plating surface is highly dependent upon the electroplating current density. Embodiments of the invention vary the electroplating current waveform by implementing an initial current step sufficient to fill substrate features and a terminal current step sufficient to achieve the specified plating thickness while suppressing protrusions and within die thickness variations.