Methods of making microelectronic assemblies including compliant interfaces

An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads a...

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Bibliographische Detailangaben
Hauptverfasser: DISTEFANO THOMAS, SMITH JOHN, KOVAC ZLATA, MITCHELL CRAIG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.