Substrate treating method and apparatus

A substrate treating method for performing deionized water treatment of substrates with a treating solution including deionized water. The method includes the steps of performing chemical treatment of the substrates with a treating solution including a chemical solution, and supplying deionized wate...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAKAWA HAJIME, OSAWA ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A substrate treating method for performing deionized water treatment of substrates with a treating solution including deionized water. The method includes the steps of performing chemical treatment of the substrates with a treating solution including a chemical solution, and supplying deionized water and performing deionized water treatment. The step of performing deionized water treatment is executed by using a treating solution having a specific resistance value lower than a reference specific resistance value of deionized water. The deionized water treatment is terminated in a deionized water treating time that elapses before the reference specific resistance value is attained.