Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arran...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KRONINGER WERNER, LUTZKE MELANIE, HECHT FRANZ
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.