Thermal interposer for cooled electrical packages

Thermal interposer for cooled electrical packages

The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally,...

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Hauptverfasser: DAUGHERTY DAVID, CORONATI JOHN M, FUCHS CHRISTOPHER, GEARY JOHN M, DERKITS GUSTAV E.JR, LISCHNER DAVID J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator DAUGHERTY DAVID
CORONATI JOHN M
FUCHS CHRISTOPHER
GEARY JOHN M
DERKITS GUSTAV E.JR
LISCHNER DAVID J
description The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Thermal interposer for cooled electrical packages
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