Thermal interposer for cooled electrical packages

Thermal interposer for cooled electrical packages

The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DAUGHERTY DAVID, CORONATI JOHN M, FUCHS CHRISTOPHER, GEARY JOHN M, DERKITS GUSTAV E.JR, LISCHNER DAVID J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow.