Solution treatment apparatus and solution treatment method

A solution treatment apparatus of the present invention includes a diaphragm position varying mechanism configured to partly vary the position of a diaphragm. According to the solution treatment apparatus of the present invention, partial positional change of the diaphragm is possible. Therefore, un...

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Bibliographische Detailangaben
Hauptverfasser:	SATO HIROSHI, CHUNG GISHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A solution treatment apparatus of the present invention includes a diaphragm position varying mechanism configured to partly vary the position of a diaphragm. According to the solution treatment apparatus of the present invention, partial positional change of the diaphragm is possible. Therefore, uniformity of solution treatment in a surface of a substrate can be effectively improved.