Co-curable compositions

The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free-radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the ani...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANG KANG, NEFF BENJAMIN, ZHANG ZHENGJUE, LIU PUWEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free-radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the anionically or cationically reactive component and the free radical polymerizable component through functionalization with at least one group reactive through an anionic or cationic mechanism and at least one group reactive through a free radical mechanism. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.