Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers

There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is ell...

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Bibliographische Detailangaben
Hauptverfasser: OKAMOTO TAKAHIRO, MIYAUCHI HIROYUKI, SHIHO HIROSHI, KAWAHASHI NOBUO, HOSAKA YUKIO, HASEFAWA KOU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1. The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.