FEATURE TARGETED INSPECTION
A method of inspecting a subject integrated circuit. A set of historical integrated circuits is inspected to detect defects and produce historical data. Features of the historical integrated circuits that have an occurrence of defects that is greater than a given limit are designated as high risk fe...
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| creator | MADGE ROBERT |
| description | A method of inspecting a subject integrated circuit. A set of historical integrated circuits is inspected to detect defects and produce historical data. Features of the historical integrated circuits that have an occurrence of defects that is greater than a given limit are designated as high risk features, based on the historical data. Locations of the high risk features are identified on the subject integrated circuit. The locations of the high risk features are input into an inspection tool, and the locations of the high risk features on the integrated circuit are inspected to at least one of detect defects and measure critical dimensions, and produce subject data. |
| format | Patent |
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Features of the historical integrated circuits that have an occurrence of defects that is greater than a given limit are designated as high risk features, based on the historical data. Locations of the high risk features are identified on the subject integrated circuit. The locations of the high risk features are input into an inspection tool, and the locations of the high risk features on the integrated circuit are inspected to at least one of detect defects and measure critical dimensions, and produce subject data.</description><edition>7</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CALCULATING ; CINEMATOGRAPHY ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050908&DB=EPODOC&CC=US&NR=2005197728A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050908&DB=EPODOC&CC=US&NR=2005197728A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MADGE ROBERT</creatorcontrib><title>FEATURE TARGETED INSPECTION</title><description>A method of inspecting a subject integrated circuit. A set of historical integrated circuits is inspected to detect defects and produce historical data. Features of the historical integrated circuits that have an occurrence of defects that is greater than a given limit are designated as high risk features, based on the historical data. Locations of the high risk features are identified on the subject integrated circuit. The locations of the high risk features are input into an inspection tool, and the locations of the high risk features on the integrated circuit are inspected to at least one of detect defects and measure critical dimensions, and produce subject data.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CALCULATING</subject><subject>CINEMATOGRAPHY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2c3UMCQ1yVQhxDHJ3DXF1UfD0Cw5wdQ7x9PfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgamhpbm5kYWjobGxKkCAN8cIaA</recordid><startdate>20050908</startdate><enddate>20050908</enddate><creator>MADGE ROBERT</creator><scope>EVB</scope></search><sort><creationdate>20050908</creationdate><title>FEATURE TARGETED INSPECTION</title><author>MADGE ROBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2005197728A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CALCULATING</topic><topic>CINEMATOGRAPHY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>MADGE ROBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MADGE ROBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FEATURE TARGETED INSPECTION</title><date>2005-09-08</date><risdate>2005</risdate><abstract>A method of inspecting a subject integrated circuit. A set of historical integrated circuits is inspected to detect defects and produce historical data. Features of the historical integrated circuits that have an occurrence of defects that is greater than a given limit are designated as high risk features, based on the historical data. Locations of the high risk features are identified on the subject integrated circuit. The locations of the high risk features are input into an inspection tool, and the locations of the high risk features on the integrated circuit are inspected to at least one of detect defects and measure critical dimensions, and produce subject data.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | FEATURE TARGETED INSPECTION |
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