Thermal head and bonding connection method therefor

A thermal head includes a head substrate having a common electrode and individual electrodes connected to exothermic bodies and a driving IC substrate having driving ICs controlling electrification of the individual electrodes and IC electrode pads arranged substantially in parallel with and at a sm...

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Bibliographische Detailangaben
Hauptverfasser:	MAJIMA HIDETOMI, MOROE MICHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A thermal head includes a head substrate having a common electrode and individual electrodes connected to exothermic bodies and a driving IC substrate having driving ICs controlling electrification of the individual electrodes and IC electrode pads arranged substantially in parallel with and at a smaller pitch (at most 60 mum) than the exothermic bodies. The individual electrodes and the corresponding IC electrode pads are bonded together with connection wire having a diameter of at most 23 mum. The connection wire includes a connection portion with a width larger than the wire diameter that is connected to the individual electrodes or the IC electrode pads and an upstanding portion raised from the connection portion at a predetermined angle. The surface area of the connection portion is not less than 0.0015 mm2 and the sectional area of the upstanding portion is not less than 0.00025 mm2.