Apparatus and method for treating disc-shaped substrates

In order to carry out simple, low-cost, uniform treatment of substrates, a device is provided for the processing of disk-shaped substrates, especially semiconductor wafers, comprising a substantially flat carrier ring, which can be rotated on a plane about an axis of rotation by means of a rotation device, and at least three support elements extending from the plane of the carrier ring, forming a multi-point support for the support at a distance from the plane of the carrier ring. The invention also relates to a device and a method for the treatment of disk-shaped substrates, especially semiconductor wafers, wherein the substrates are rotated about an axis of rotation which is disposed in a substantially vertical position with respect to the plane of the substrates and whereby at least one first group of nozzles are disposed at various distances from the axis of rotation, enabling a first fluid to be applied, said nozzles being controlled either individually or in sub-groups, in order to carry out selective treatment of surface areas of the substrate.